Intel Xeon Silver 4410Y - 2 GHz - 12 Kerne - 24 Threads - 30 MB Cache-Speicher - FCLGA4677 Socket - OEM

Kategorie Intel-Prozessoren
Produktcode PK8071305120002
Marke Intel
Die Bilder können vom Original abweichen
Lager Stk. vor. Lieferdatum Preis
MwSt.
TDCH4 0  27.08.2026 Zulauf unbekannt 639.79
TDCH2 0 Zulauf unbekannt 639.79
ALSCH 0 Zulauf unbekannt 700.60
DK773 0 Zulauf unbekannt 1’331.13
DK773 0 Zulauf unbekannt 1’331.13
Produktbeschreibung
Intel Xeon Silver 4410Y / 2 GHz Prozessor - OEM
Produkttyp
Prozessor
Prozessortyp
Intel Xeon Silver 4410Y (4. Gen.)
Anz. der Kerne
12 Kerne / 24 Threads
Cache-Speicher
30 MB
Geeignete Sockel
FCLGA4677 Socket
Prozessoranz.
1
Taktfrequenz
2 GHz
Max. Turbo-Taktfrequenz
3.9 GHz
Herstellungsprozess
10 nm
Funktionen
Intel On Demand Feature Activation, Intel Deep Learning Boost (DL Boost), Intel Speed Select technology - Performance Profile, Intel Resource Director Technology (RDT), Intel Speed Shift Technology, Intel Turbo Boost Technology 2.0, Intel Transactional Synchronization Extensions (TSX), Intel 64 Technology, Intel Advanced Matrix Extensions, Streaming-SIMD-Erweiterungen 4.2, Advanced Vector Extensions (AVX), Advanced Vector Extensions 2 (AVX2), Intel Advanced Vector Extensions 512 (AVX-512), Intel Crypto Acceleration, Intel Platform Firmware Resilience Support, Intel Control-Flow Enforcement Technology, Intel Total Memory Encryption, Intel AES New Instructions (AES-NI), Intel Software Guard Extensions (SGX), Intel OS Guard, Intel Trusted Execution Technology, Mode-based Execute Control (MBEC), Intel Virtualization Technology, Intel Virtualization Technology for Directed I/O (VT-d), Intel VT-x with Extended Page Tables (EPT), 64 GB maximale Größe des Enclave Page Cache (EPC) für Intel SGX
Produkttyp
Prozessor
Typ / Formfaktor
Intel Xeon Silver 4410Y (4. Gen.)
Anz. der Kerne
12 Kerne
Anz. der Threads
24 Threads
Cache-Speicher
30 MB
Cache-Speicher-Details
Smart Cache - 30 MB
Prozessoranz.
1
Taktfrequenz
2 GHz
Max. Turbo-Taktfrequenz
3.9 GHz
Geeignete Sockel
FCLGA4677 Socket
Herstellungsprozess
10 nm
Thermal Design Power (TDP)
150 W
Temperaturspezifikationen
78 °C
PCI Express Revision
5.0
Anz. PCI Express Lanes
80
Architektur-Merkmale
Intel On Demand Feature Activation, Intel Deep Learning Boost (DL Boost), Intel Speed Select technology - Performance Profile, Intel Resource Director Technology (RDT), Intel Speed Shift Technology, Intel Turbo Boost Technology 2.0, Intel Transactional Synchronization Extensions (TSX), Intel 64 Technology, Intel Advanced Matrix Extensions, Streaming-SIMD-Erweiterungen 4.2, Advanced Vector Extensions (AVX), Advanced Vector Extensions 2 (AVX2), Intel Advanced Vector Extensions 512 (AVX-512), Intel Crypto Acceleration, Intel Platform Firmware Resilience Support, Intel Control-Flow Enforcement Technology, Intel Total Memory Encryption, Intel AES New Instructions (AES-NI), Intel Software Guard Extensions (SGX), Intel OS Guard, Intel Trusted Execution Technology, Mode-based Execute Control (MBEC), Intel Virtualization Technology, Intel Virtualization Technology for Directed I/O (VT-d), Intel VT-x with Extended Page Tables (EPT), 64 GB maximale Größe des Enclave Page Cache (EPC) für Intel SGX
Verpackung
OEM/Tray
Transportbreite
7.75 cm
Transporttiefe
5.65 cm