Enermax ETS-F40-FS - Processor cooler - (for: LGA1156, AM2, AM2+, LGA1366, AM3, LGA1155, AM3+, LGA2011, FM1, FM2, LGA1150, FM2+, LGA2011-3, LGA1151, AM4, LGA2066, LGA1200) - aluminium and copper - 140 mm

類別: 電腦冷卻器
代碼: ETS-F40-FS
品牌: Enermax Technology
保修: 12 月
製造商(由CNet)
 
未知
DE181
 
未知
APIDE
 
未知
ALSDE-2
 
未知
DE712
 
未知
DK773
 
12 月
僅供說明用途
庫存 數量 預計配送 價格
增值稅
DE181 3 7/5/2024 ~ 4周 62.25
APIDE 11 9/5/2024 ~ 4周 63.25
ALSDE-2 39 9/5/2024 ~ 4周 67.18
DE712 39 17/5/2024 ~ 4周 74.32
DK773  11  17/5/2024 ~ 4周 69.78
Product Description
Enermax ETS-F40-FS - processor cooler
Product Type
Processor cooler
Package Content
Thermal paste, fan, 4 washers, 4 screws, backplate, fan clips for second fan, AMD mounting bracket, heatsink, 4 standoffs, 4 nuts, 2 Intel CPU mounting clip, 4 LGA-2011 screws, 4 AMD screws
Compatibility
LGA1156 Socket, Socket AM2, Socket AM2+, LGA1366 Socket, Socket AM3, LGA1155 Socket, Socket AM3+, LGA2011 Socket, Socket FM1, Socket FM2, LGA1150 Socket, Socket FM2+, LGA2011-3 Socket, LGA1151 Socket, Socket AM4, LGA2066 Socket, LGA1200 Socket
Heatsink Material
Aluminium and copper
Fan Diameter
140 mm
Fan Height
25.5 mm
Rotation Speed
300-1200 rpm
Air Flow
18.11-74.33 cfm
Noise Level
10 - 23 dBA
Power Connector
4-pin fan connector
Rated Voltage
12 V
Features
Heat-pipe Direct Touch (H.D.T.) Technology, Pulse-width modulation (PWM) support, 4 copper heatpipes (6 mm), Vortex generator flow (VGF) technology, Vacuum Effect (VEF) technology, TDP up to 200W
Dimensions (WxDxH)
15.55 cm x 14 cm x 6.5 cm
Weight
750 g
Product Type
Processor cooler
Package Content
Thermal paste, fan, 4 washers, 4 screws, backplate, fan clips for second fan, AMD mounting bracket, heatsink, 4 standoffs, 4 nuts, 2 Intel CPU mounting clip, 4 LGA-2011 screws, 4 AMD screws
Width
15.55 cm
Depth
14 cm
Height
6.5 cm
Weight
750 g
Shipping Dimensions (WxDxH) / Weight
14.5 cm x 12.4 cm x 18.2 cm / 900 g
Compatible With
LGA1156 Socket, Socket AM2, Socket AM2+, LGA1366 Socket, Socket AM3, LGA1155 Socket, Socket AM3+, LGA2011 Socket, Socket FM1, Socket FM2, LGA1150 Socket, Socket FM2+, LGA2011-3 Socket, LGA1151 Socket, Socket AM4, LGA2066 Socket, LGA1200 Socket
Heatsink Material
Aluminium and copper
Heatsink Dimensions
140 mm x 65 mm x 155.5 mm
Fan Diameter
140 mm
Fan Height
25.5 mm
Rotation Speed
300-1200 rpm
Air Flow
18.11-74.33 cfm
Air Pressure
0.13-2.17 mm
Noise Level
10 - 23 dBA
Power Connector
4-pin fan connector
Rated Voltage
12 V
Rated Current
0.15 A
Features
Heat-pipe Direct Touch (H.D.T.) Technology, Pulse-width modulation (PWM) support, 4 copper heatpipes (6 mm), Vortex generator flow (VGF) technology, Vacuum Effect (VEF) technology, TDP up to 200W
MTBF
100,000 hour(s)