Intel Xeon Gold 5217 - 3 GHz - 8 Kerne - 16 Threads - 11 MB Cache-Speicher - LGA3647 Socket - OEM

Kategorie Intel-Prozessoren
Produktcode CD8069504214302
Marke Intel
Garantie 12 Monate
Die Bilder können vom Original abweichen
Lager Stk. vor. Lieferdatum Preis
MwSt.
AT242 1 01.04.2026 Zulauf unbekannt 2.974,82
DK773  1  15.04.2026 Zulauf unbekannt 4.505,27
DK773 0 Zulauf unbekannt 4.505,27

Marketing Beschreibung

With support for higher memory speeds, enhanced memory capacity, and up-to four-socket scalability, Intel Xeon Gold processors deliver improved performance, enhanced memory capabilities, advanced security technologies, and built-in workload acceleration. These processors are optimized for demanding mainstream data center, cloud compute, and network and storage workloads. With up to four-socket scalability, they are suitable for an expanded range of workloads.

Produktbeschreibung
Intel Xeon Gold 5217 / 3 GHz Prozessor - OEM
Produkttyp
Prozessor
Prozessortyp
Intel Xeon Gold 5217
Anz. der Kerne
8 Kerne / 16 Threads
Cache-Speicher
11 MB
Geeignete Sockel
LGA3647 Socket
Prozessoranz.
1
Taktfrequenz
3 GHz
Max. Turbo-Taktfrequenz
3.7 GHz
Herstellungsprozess
14 nm
Funktionen
Enhanced SpeedStep technology, Hyper-Threading-Technologie, Unterstützung für Execute Disable Bit, Intel Virtualization Technology, Intel 64 Technology, Intel Trusted Execution Technology, Intel Turbo Boost Technology 2.0, Intel AES New Instructions (AES-NI), Intel Virtualization Technology for Directed I/O (VT-d), Intel vPro Technology, Intel VT-x with Extended Page Tables (EPT), Intel TSX-NI, Intel Speed Shift Technology, Intel Optane Memory Supported, Intel Advanced Vector Extensions 512 (AVX-512), Mode-based Execute Control (MBE), Intel Volume Management Device (VMD), Intel Run Sure Technology, Intel Deep Learning Boost (DL Boost), Intel Resource Director Technology (RDT)
Produkttyp
Prozessor
Typ / Formfaktor
Intel Xeon Gold 5217
Anz. der Kerne
8 Kerne
Anz. der Threads
16 Threads
Cache-Speicher
11 MB
Cache-Speicher-Details
Smart Cache - 11 MB
Prozessoranz.
1
Taktfrequenz
3 GHz
Max. Turbo-Taktfrequenz
3.7 GHz
Geeignete Sockel
LGA3647 Socket
Herstellungsprozess
14 nm
Thermal Design Power (TDP)
115 W
Temperaturspezifikationen
79 °C
PCI Express Revision
3.0
Anz. PCI Express Lanes
48
Architektur-Merkmale
Enhanced SpeedStep technology, Hyper-Threading-Technologie, Unterstützung für Execute Disable Bit, Intel Virtualization Technology, Intel 64 Technology, Intel Trusted Execution Technology, Intel Turbo Boost Technology 2.0, Intel AES New Instructions (AES-NI), Intel Virtualization Technology for Directed I/O (VT-d), Intel vPro Technology, Intel VT-x with Extended Page Tables (EPT), Intel TSX-NI, Intel Speed Shift Technology, Intel Optane Memory Supported, Intel Advanced Vector Extensions 512 (AVX-512), Mode-based Execute Control (MBE), Intel Volume Management Device (VMD), Intel Run Sure Technology, Intel Deep Learning Boost (DL Boost), Intel Resource Director Technology (RDT)
Verpackung
OEM/Tray